Light emitting device and light emitting module

ABSTRACT

A light emitting device including a plurality of element structures each including a submount, a light emitting element, and a light transmissive member, in this order. The light emitting device further includes a first cover member holding the element structures by covering lateral faces of each of the element structures.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No.2019-125235 filed on Jul. 4, 2019, and Japanese Patent Application No.2019-133169 filed on Jul. 18, 2019, the disclosures of which are herebyincorporated by reference in their entireties. This application is acontinuation of U.S. application Ser. No. 16/917,903, filed on Jul. 1,2020, the entire contents of which is herein incorporated by reference.

BACKGROUND

The present disclosure relates to a method of manufacturing a lightemitting device, a method of manufacturing a light emitting module, alight emitting device, and a light emitting module.

A light emitting device having a plurality of emission faces has beenknown. For example, Japanese Patent Publication No. 2016-27620 describesa light emitting device including a plurality of light emittingelements, light transmissive members covering the upper faces of thelight emitting elements, and a light reflecting member collectivelycovering the lateral faces of the light emitting elements.

SUMMARY

The structure described above has room for further improvement in termsof densely arranging a plurality of emission faces.

Embodiments of the present disclosure provide a method of manufacturinga light emitting device and a method of manufacturing a light emittingmodule in which intervals between the emission faces are narrow, as wellas providing a light emitting device and a light emitting module inwhich intervals between the emission faces are narrow.

A method of manufacturing a light emitting device according to anembodiment of the present disclosure includes: providing a plurality offirst element structures each including a submount, a light emittingelement, and a light transmissive member, in this order; disposing thefirst element structures on a sheet member such that the submount ineach of the first element structures faces the sheet member; and forminga first cover member on the sheet member so as to cover lateral faces ofthe first element structures.

A method of manufacturing a light emitting device according to anotherembodiment of the present disclosure includes: providing a plurality offirst element structures each including a submount, a light emittingelement, and a light transmissive member, in this order; disposing thefirst element structures on a sheet member such that the submounts ineach of the first element structures faces the sheet member; forming asecond cover member on the sheet member so as to cover lateral faces ofthe submounts; and forming a first cover member on the second covermember so as to cover lateral faces of the light emitting elements andlateral faces of the light transmissive members, wherein the first covermember has a higher light reflectance relative to light from the lightemitting elements than a reflectance of the second cover member.

A method of manufacturing a light emitting device according to anotherembodiment of the present disclosure includes: providing a plurality ofsecond element structures each including a submount and a light emittingelement, in this order; disposing the second element structures on asheet member such that the substrate of each of the second elementstructures faces the sheet member; respectively disposing lighttransmissive members on the light emitting elements after disposing thesecond element structures on the sheet member; and forming a first covermember on the sheet member so as to cover lateral faces of the secondelement structures and lateral faces of the light transmissive members.

A method of manufacturing a light emitting device according to anotherembodiment of the present disclosure includes: providing a plurality ofsecond element structures each including a submount and a light emittingelement in this order; disposing the second element structures on asheet member such that the submount of each of the second elementstructures faces the sheet member; respectively disposing lighttransmissive members on the light emitting elements after disposing thesecond element structures on the sheet member; forming a second covermember on the sheet member so as to cover the lateral faces of thesubmounts; and forming a first cover member on the second cover memberso as to cover lateral faces of the light emitting elements and lateralfaces of the light transmissive members, wherein the first cover memberhas a higher light reflectance relative to light from the light emittingelements than a light reflectance of the second cover member.

A method of manufacturing a light emitting module according to anembodiment of the present disclosure includes: providing a lightemitting device by using any of the methods of manufacturing the lightemitting device described above, and disposing the light emitting deviceon a module substrate such that the submounts face the module substrate.

A method of manufacturing a light emitting module according to anotherembodiment of the present disclosure includes: providing a plurality offirst element structures each including a submount, a light emittingelement, and a light transmissive member, in this order; disposing thefirst element structures on a module substrate such that the submount ofeach of the first element structures faces the module substrate; forminga frame on the module substrate so as to surround the first elementstructures; and forming a first cover member inward of the frame so asto cover lateral faces of the first element structures.

A light emitting device according to an embodiment of the presentdisclosure includes: a plurality of first element structures eachincluding a submount, a light emitting element, and a light transmissivemember, in this order; and a first cover member holding the firstelement structures in place by covering the lateral faces of the firstelement structures.

A light emitting device according to another embodiment of the presentdisclosure includes: a plurality of first element structures, eachincluding a submount, a light emitting element, and a light transmissivemember, in this order; a second cover member holding the first elementstructures in place by covering lateral faces of the submounts; and afirst cover member holding the first element structures in place bycovering lateral faces of the light emitting elements and lateral facesof the light transmissive members, the first cover member having ahigher light reflectance relative to light from the light emittingelements than a light reflectance of the second cover member.

A light emitting module according to another embodiment of the presentdisclosure includes: any of the light emitting devices described above,and a module substrate on which the light emitting device is disposedsuch that the submounts face the module substrate.

The method of manufacturing a light emitting device according to any ofthe embodiments of the present disclosure can manufacture a lightemitting device in which intervals between the emission faces arenarrow.

The method of manufacturing a light emitting module according to any ofthe embodiments of the present disclosure can manufacture a lightemitting module in which intervals between the emission faces arenarrow.

The light emitting device according to any of the embodiments of thepresent disclosure can have narrow intervals between the emission faces.

The light emitting module according to any of the embodiments of thepresent disclosure can have narrow intervals between the emission faces.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view schematically showing the structure of alight emitting module including a light emitting device according to afirst embodiment.

FIG. 1B is a top view schematically showing the structure of the lightemitting module including the light emitting device according to thefirst embodiment.

FIG. 1C is a sectional view taken along line IC-IC in FIG. 1B.

FIG. 1D is a sectional view taken along line ID-ID in FIG. 1B.

FIG. 1E is a sectional view schematically showing the structure of thelight emitting device according to the first embodiment.

FIG. 1F is a bottom view schematically showing the structure of thelight emitting device according to the first embodiment.

FIG. 2 is a flowchart of a method of manufacturing the light emittingdevice according to the first embodiment.

FIG. 3 is a flowchart of a method of manufacturing the light emittingmodule according to the first embodiment.

FIG. 4A is a sectional view showing the process of disposing lightemitting elements in the first element structure providing process ofthe method of manufacturing the light emitting device according to thefirst embodiment.

FIG. 4B is a sectional view showing the process of disposing lighttransmissive members in the first element structure providing process ofthe method of manufacturing the light emitting device according to thefirst embodiment.

FIG. 4C is a sectional view showing the process of providing firstelement structures in the first element structure providing process ofthe method of manufacturing the light emitting device according to thefirst embodiment.

FIG. 4D is a sectional view showing the process of forming a frame inthe method of manufacturing the light emitting device according to thefirst embodiment.

FIG. 4E is a sectional view showing the process of disposing the firstelement structures in the method of manufacturing the light emittingdevice according to the first embodiment.

FIG. 4F is a sectional view showing the process of forming a first covermember in the method of manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 4G is a sectional view showing the process of removing the sheetmember in the method of manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 4H is a sectional view showing the process of disposing a lightemitting device in the method of manufacturing the light emitting moduleaccording to the first embodiment.

FIG. 4I is a top view showing the process of disposing first elementstructures in the method of manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 4J is a top view showing the process of forming a first covermember in the method of manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 4K is a top view showing the process of disposing a light emittingdevice in the method of manufacturing the light emitting moduleaccording to the first embodiment.

FIG. 5A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to a secondembodiment.

FIG. 5B is a sectional view taken along line VB-VB in FIG. 5A.

FIG. 5C is a sectional view schematically showing the structure of thelight emitting device according to the second embodiment.

FIG. 6 is a flowchart of a method of manufacturing the light emittingdevice according to the second embodiment.

FIG. 7A is a sectional view showing the process of forming a secondcover member in the method of manufacturing the light emitting deviceaccording to the second embodiment.

FIG. 7B is a sectional view showing the process of forming a first covermember in the method of manufacturing the light emitting deviceaccording to the second embodiment.

FIG. 7C is a sectional view showing the process of removing the sheetmember in the method of manufacturing the light emitting deviceaccording to the second embodiment.

FIG. 7D is a sectional view showing the process of disposing a lightemitting device in the method of manufacturing the light emitting moduleaccording to the second embodiment.

FIG. 7E is a top view showing the process of forming a second covermember in the method of manufacturing the light emitting deviceaccording to the second embodiment.

FIG. 7F is a top view showing the process of forming a first covermember in the method of manufacturing the light emitting deviceaccording to the second embodiment.

FIG. 7G is a top view showing the process of disposing a light emittingdevice in the method of manufacturing the light emitting moduleaccording to the second embodiment.

FIG. 8A is a top view schematically showing the structure of a lightemitting module including the light emitting device according to a thirdembodiment.

FIG. 8B is a sectional view taken along line VIIIB-VIIIB in FIG. 8A.

FIG. 8C is a sectional view schematically showing the structure of thelight emitting device according to the third embodiment.

FIG. 9 is a flowchart of a method of manufacturing the light emittingdevice according to the third embodiment.

FIG. 10A is a sectional view showing the process of disposing lightemitting elements in second element structure providing process of themethod of manufacturing the light emitting device according to the thirdembodiment.

FIG. 10B is a sectional view showing the process of providing the secondelement structures in the second element structure providing process ofthe method of manufacturing the light emitting device according to thethird embodiment.

FIG. 10C is a sectional view showing the process of forming a frame inthe method of manufacturing the light emitting device according to thethird embodiment.

FIG. 10D is a sectional view showing the process of disposing the secondelement structures in the method of manufacturing the light emittingdevice according to the third embodiment.

FIG. 10E is a sectional view showing the process of disposing lighttransmissive members in the method of manufacturing the light emittingdevice according to the third embodiment.

FIG. 10F is a sectional view showing the process of forming a firstcover member in the method of manufacturing the light emitting deviceaccording to the third embodiment.

FIG. 10G is a sectional view showing the process of removing the sheetmember in the method of manufacturing the light emitting deviceaccording to the third embodiment.

FIG. 10H is a sectional view showing the process of disposing a lightemitting device in the method of manufacturing the light emitting moduleaccording to the third embodiment.

FIG. 11A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to a fourthembodiment.

FIG. 11B is a sectional view taken along line XIB-XIB in FIG. 11A.

FIG. 11C is a sectional view schematically showing the structure of alight emitting device according to the fourth embodiment.

FIG. 12 is a flowchart of a method of manufacturing a light emittingdevice according to the fourth embodiment.

FIG. 13A is a sectional view schematically showing the structure of alight emitting module including a light emitting device according toanother embodiment.

FIG. 13B is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13C is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13D is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13E is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13F is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13G is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 13H is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 14A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment.

FIG. 14B is a sectional view taken along line XIVB-XIVB in FIG. 14A.

FIG. 14C is a bottom view schematically showing the structure of thelight emitting device according to the embodiment shown in FIG. 14A.

FIG. 15A is a sectional view schematically showing the structure of alight emitting module according to another embodiment.

FIG. 15B is a flowchart of a method of manufacturing the light emittingmodule according to the embodiment shown in FIG. 15A.

DESCRIPTION

Certain embodiments will be explained below with reference to theaccompanying drawings. The embodiments described below are illustrationsof methods of manufacturing light emitting devices and light emittingmodules, and illustrations of light emitting devices and light emittingmodules, for the purpose of embodying the technical ideas of the presentinvention, and are not intended to limit the present disclosure to thosedescribed below. The sizes, the shapes, and the relative positions of,or the materials employed for, the constituents described in theembodiments are not intended to limit the scope of the present inventionunless otherwise specifically noted, and are merely provided asexamples. The sizes and positional relationship of the members shown inthe drawings might be exaggerated for clarity of explanation.

First Embodiment

FIG. 1A is a perspective view schematically showing the structure of alight emitting module including a light emitting device according to afirst embodiment. FIG. 1B is a top view schematically showing thestructure of the light emitting module including the light emittingdevice according to the first embodiment. FIG. 1C is a sectional viewtaken along line IC-IC in FIG. 1B. FIG. 1D is a sectional view takenalong line ID-ID in FIG. 1B. FIG. 1E is a sectional view schematicallyshowing the structure of the light emitting device according to thefirst embodiment. FIG. 1F is a bottom view schematically showing thestructure of the light emitting device according to the firstembodiment.

A light emitting module 200 includes a light emitting device 100 and amodule substrate 80.

Light Emitting Device

A light emitting device 100 will be explained below.

The light emitting device 100 includes a plurality of first elementstructures 15 and a first cover member 40. The first element structures15 each include a submount 10, a light emitting element 20, and a lighttransmissive member 30, in this order. The first cover member 40 holdsthe first element structures 15 in place by covering the lateral facesof the first element structures 15.

In other words, the light emitting device 100 includes submounts 10,light emitting elements 20, protective elements 25, light transmissivemembers 30, a first cover member 40, and a frame 50, as main components.

Each constituent of the light emitting device 100 will be explainednext.

The submount 10 is a member on which the light emitting element 20 andthe protective element 25 are mounted, and includes wiring forelectrically connecting the light emitting device 100 to an externalcircuit. The submount 10 has, for example, substantially rectangularshape in a top view. Each submount 10 includes a base part 2, firstwiring parts 3, internal wiring parts 4, and second wiring parts 5.

The base part 2 is preferably formed of an insulating material which isless likely to transmit the light emitted from the light emittingelements 20 and external light. Examples of materials usable for thebase part 2 include ceramics, such as alumina, aluminum nitride,mullite, and the like, thermoplastic resins, such as polyamide (PA),polyphthalamide (PPA), polyphenylene sulfide (PPS), liquid crystalpolymers, and other resins, such as epoxy resins, silicone resins,modified epoxy resins, urethane resins, phenol resins, and the like.Among such examples, a ceramic material is preferably used due to itsgood heat dissipation properties.

In the light emitting device 100, the interval between adjacentsubmounts 10 preferably in a range from 0.05 mm to 0.2 mm. Accordingly,the thickness of the first cover member 40 disposed between submounts 10will be in a range from 0.05 mm to 0.2 mm. This can not only closelyjoin adjacent submounts 10, but also reduce the impact of thermalstress.

The first wiring parts 3 are disposed on the upper face of a base part2, and are electrically connected to the light emitting element 20 andthe protective element 25. The second wiring parts 5 are disposed on thelower face of the base part 2, and are electrically connected asexternal electrodes of the light emitting device 100 to an externalpower supply. The internal wiring parts 4 are disposed in the throughholes penetrating the base part 2, and respectively electrically connectthe first wiring parts 3 and the second wiring parts 5. The lightemitting device do not have to include any protective elements 25.

The first wiring parts 3, the internal wiring parts 4, and the secondwiring parts 5 can be formed of a metal, such as Fe, Cu, Ni, Al, Ag, Au,Pt, Ti, W, Pd, or the like, or an alloy containing at least one ofthese. The first wiring parts 3, the internal wiring parts 4, and thesecond wiring parts 5 can be formed by, for example, electrolyticplating, electroless plating, vapor deposition, sputtering, or the like.

A light emitting element 20 can be a semiconductor element which itselfemits light when a voltage is applied. The light emitting element 20 canhave any shape and size appropriately selected. As for the color oflight, any wavelength can be selected for the light emitting element 20in accordance with the use. For example, for a light emitting element 20emitting blue light (a wavelength of from 430 nm to 500 nm) or greenlight (a wavelength of from 500 nm to 570 nm), a nitride semiconductor,In_(x)Al_(y)Ga_(1-x-y)N (0≤X, 0≤Y, X+Y≤1), GaP, and the like can beemployed. For a light emitting element 20 emitting red light (awavelength of from 610 nm to 700 nm), GaAlAs, AlInGaP, nitride-basedsemiconductor elements, and the like can be used.

A light emitting element 20 has a pair of positive and negativeelectrodes 23 on one face, and is flip-chip mounted on the first wiringparts 3 on the submount 10 using a conductive bonding material. Examplesof the conductive bonding materials include eutectic solder, conductivepaste, bumps, or the like.

A protective element 25 is, for example, a Zener diode. The protectiveelement 25 has a pair of positive and negative electrodes 27 on oneface, and is flip-chip mounted on the first wiring parts 3 on thesubmount 10.

A light transmissive member 30 is a transmissive member formed of, forexample, a resin, glass, inorganic material, or the like. The lighttransmissive member 30 is disposed and formed on a light emittingelement 20. The light transmissive member 30 preferably has a largerupper face than the upper face of the light emitting element 20.

In the light emitting device 100, the distance between portions ofadjacent light transmissive members 30 exposed at the upper face of thelight emitting device 100 is preferably 0.2 mm at most. Having thedistance between portions of adjacent light transmissive members 30 of0.2 mm at most can reduce the size of a light source when applied to anadaptive driving beam (ADB) headlight, for example, thereby reducing thesize of the headlight lens. Accordingly, a primary lens can be omittedin the optical system. This can also reduce the loss of light passingthrough the headlight lens. From the perspective of further reducing thesize of a light source, the distance between adjacent light transmissivemembers 30 is more preferably 0.1 mm at most, even more preferably 0.05mm at most. From a perspective of an ease of manufacturing the lightemitting device 100, the distance between adjacent light transmissivemembers 30 is preferably at least 0.03 mm.

As seen in a top view, the light transmissive member 30 can have anyappropriate shape, including a circular shape, elliptical shape,polygonal shape, such as square, hexagon, and the like. Among theseshapes, a quadrangle, such as a square, rectangle, or the like ispreferable, and a shape similar to the shape of the light emittingelement 20 is more preferable.

The light transmissive member 30 can contain a wavelength conversionmaterial. Examples of wavelength conversion materials include phosphors.Examples of a light transmissive member 30 containing a phosphorinclude, for example, a sintered body of a phosphor, or a resin, glass,ceramic or any other inorganic material containing phosphor powder. Thelight transmissive member 30 can be one having a resin or glass layercontaining a phosphor formed on a formed body made of a resin, glass,ceramic material or the like. Moreover, the light transmissive member 30can contain a filler such as a diffuser depending on the purpose. In thecase of containing a filler such as a diffuser, the light transmissivemember 30 can be one made of a resin, glass, ceramic or any otherinorganic material which contains the filler, or one that has a resin orglass layer containing the filler formed on a formed body made of aresin, glass, ceramic, material or the like.

For phosphors, those known in the art can be used. Examples of greenlight emitting phosphors include yttrium aluminum garnet based phosphors(e.g., Y₃(Al,Ga)₅O₁₂:Ce), lutetium aluminum garnet based phosphors(e.g., Lu₃(Al,Ga)₅O₁₂:Ce), terbium aluminum garnet based phosphors(e.g., Tb₃(Al,Ga)₅O₁₂:Ce), silicate based phosphors (e.g.,(Ba,Sr)₂SiO₄:Eu), chlorosilicate based phosphors (e.g.,Ca₈Mg(SiO₄)₄C₁₂:Eu), β-SiAlON based phosphors (e.g.,Si_(6-z)Al_(z)O_(z)N_(8-z):Eu (0<z<4.2)), SGS based phosphors (e.g.,SrGa₂S₄:Eu) and the like. Examples of yellow light emitting phosphorsinclude α-SiAlON based phosphors (e.g., M_(z)(Si,Al)₁₂(O,N)₁₆ (0<z≤2,and M is Li, Mg, Ca, Y, and lanthanide elements excluding La and Ce),and the like. Some of the green light emitting phosphors above are alsoyellow light emitting phosphors.

For example, the peak emission wavelengths of yttrium aluminum garnetphosphors can be shifted to longer wavelengths by replacing a portion ofY with Gd to emit yellow light. Some of these phosphor can emit orangelight. Examples of red light emitting phosphors includenitrogen-containing calcium aluminosilicate (CASN or SCASN) basedphosphors (e.g., (Sr,Ca)AlSiN₃:Eu), BSESN phosphors (e.g.,(Ba,Sr,Ca)₂Si₅N₈:Eu) and the like. Additional examples includemanganese-activated fluoride phosphors (represented by the generalformula (I), A₂[M_(1-a)Mn_(a)F₆] (in the general formula (I): “A” is atleast one selected from the group consisting of K, Li, Na, Rb, Cs, andNH₄; “M” is at least one selected from the group consisting of Group 4elements and Group 14 elements; and “a” satisfies 0<a<0.2)).Representative examples of the manganese-activated fluoride phosphorsinclude manganese-activated potassium fluorosilicate phosphors (e.g.,K₂SiF₆:Mn).

For the diffuser, those known in the art can be used. For example,barium titanate, titanium oxide, aluminum oxide, silicon oxide or thelike can be used.

Examples of resin materials for use as the light transmissive members30, or the binder for phosphors and diffusers, include thermosettingresins, such as epoxy resins, modified epoxy resins, silicone resins,modified silicone resins, and the like.

The first cover member 40 is a member formed around a plurality of firstelement structures 15. It is preferable to use a resin material for thefirst cover member 40. The first cover member 40 is formed by, forexample, covering the lateral faces of the first element structures 15with a light reflecting resin, which is a resin containing a reflectingmaterial. In other words, the first cover member 40 covers the lateralfaces of the submounts 10, the lateral faces of the light emittingelements 20, and the lateral faces of the light transmissive members 30.The first cover member 40 is also formed between adjacent first elementstructures 15, and covers the outer lateral faces of the first elementstructures 15. In the case in which the light emitting device 100includes a frame 50, the first cover member 40 is formed inward of theframe 50 between the frame 50 and the first element structures 15 andbetween adjacent first element structures 15.

Examples of resin materials for use as the first cover member 40 includethe resins for use as the light transmissive members 30 described above.Examples of reflecting materials for use in the first cover member 40include titanium oxide, silica, silicon oxide, aluminum oxide, zirconiumoxide, magnesium oxide, potassium titanate, zinc oxide, boron nitride,and the like. Among such examples, from a light reflecting perspective,titanium oxide is preferably used due to its relatively high refractiveindex.

The frame 50 is a member for supporting first cover member 40 bysurrounding the first element structures 15. In a top view, the frame 50has a rectangular shape provided in the surrounding of the first elementstructures 15.

The frame 50 can be formed by using a frame-shaped member made of ametal, alloy, or ceramic material. Examples of metals include Fe, Cu,Ni, Al, Ag, Au, Pt, Ti, W, Pd and the like. Examples of alloys includethose containing at least one of Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, andPd.

A resin material can alternatively be used for the frame. In this case,any of the metal, alloy, or ceramic materials described above can beembedded in the frame made of a resin material, or one of some parts ofthe frame can be formed with a resin material while forming the otherpart with a metal, alloy, or ceramic material.

The light emitting device 100 includes a plurality of first elementstructures 15. In the present embodiment, as one example, 11 pieces ofthe first element structures 15 are held in place by the first covermember 40. However, the light emitting device can have 10 or less piecesof the first element structures 15, or 12 or more pieces of the firstelement structures 15.

Light Emitting Module

A light emitting module 200 will be explained next.

The light emitting module 200 includes the light emitting device 100described above, and a module substrate 80 on which the light emittingdevice 100 is disposed such that the submounts 10 faces the modulesubstrate 80.

In the case where the light emitting device 100 includes no protectiveelements 25, it is preferable that the module substrate 80 is equippedwith a protective element 25.

The light emitting device 100 is as explained above.

The module substrate 80 is a member on which the light emitting device100, and electrically connects the light emitting device 100 to theoutside. The module substrate 80 is formed to have a rectangular shapein a top view, for example. The module substrate 80 includes a substratepart 6 and third wiring parts 7.

Examples of materials to be employed for the base part 6 include thosedescribed as the materials for use as the base part 2 of a submount 10.Examples of materials to be employed for the third wiring parts 7include those described as the materials for use as the first wiringparts 3 of the submounts 10.

The light emitting device 100 is disposed on the upper face of themodule substrate 80 such that the second wiring parts 5 and the thirdwiring parts 7 are bonded via a conductive bonding material 8. For theconductive bonding material 8, for example, eutectic solder, conductivepaste, bumps or the like can be used.

In the light emitting module 200, a frame 50 is bonded to the modulesubstrate 80 via a conductive bonding material 8. Thus, the heatgenerated by the light emitting device 100 is transferred to the modulesubstrate 80 via the frame 50. Accordingly, the light emitting module200 has better heat dissipation properties. The frame 50 can be bondedto the module substrate 80 via a non-conductive bonding material, orsimply disposed on the module substrate 80 without any bonding material.

Operation of Light Emitting Module

When a light emitting module 200 is driven, an electrical current issupplied from an external power supply to the light emitting elements 20via the third wiring parts 7, the second wiring parts 5, the internalwiring parts 4, and the first wiring parts 3 to allow the light emittingelements 20 to emit light. The portion of the light emitted by the lightemitting elements 20 advancing upwards is extracted upwards of the lightemitting device 100 via the light transmissive members 30. The portionof the light advancing downwards is reflected by the submounts 10 andextracted upwards of the light emitting device 100 via the lighttransmissive members 30. The portion of the light advancing between thelight emitting elements 20 and the frame 50 is reflected by the firstcover member 40 and the frame 50, and extracted from the light emittingdevice 100 via the light transmissive members 30. The light advancing inregions between the light emitting elements 20 is reflected by the firstcover member 40 and extracted from the light emitting device 100 via thelight transmissive members 30. Providing a narrow space between adjacentlight transmissive members 30 (e.g., 0.2 mm at most) can simplify thestructure, and reduce the size, of the optical system in the case ofemploying the light emitting module 200 as the light source for anautomotive headlight, for example.

Manufacturing Methods of First Embodiment

FIG. 2 is a flowchart of a method of manufacturing a light emittingdevice according to the first embodiment. FIG. 3 is a flowchart of amethod of manufacturing a light emitting module according to the firstembodiment. FIG. 4A is a sectional view showing the process of disposinglight emitting elements in the first element structure providing processof the method of manufacturing a light emitting device according to thefirst embodiment. FIG. 4B is a sectional view showing the process ofdisposing light transmissive members in the first element structureproviding process of the method of manufacturing the light emittingdevice according to the first embodiment. FIG. 4C is a sectional viewshowing the process of providing first element structures in the firstelement structure providing process of the method of manufacturing thelight emitting device according to the first embodiment. FIG. 4D is asectional view showing the process of forming a frame in the method ofmanufacturing the light emitting device according to the firstembodiment. FIG. 4E is a sectional view showing the process of disposingthe first element structures in the method of manufacturing the lightemitting device according to the first embodiment. FIG. 4F is asectional view showing the process of forming a first cover member inthe method of manufacturing the light emitting device according to thefirst embodiment. FIG. 4G is a sectional view showing the process ofremoving the sheet member in the method of manufacturing the lightemitting device according to the first embodiment. FIG. 4H is asectional view showing the process of disposing a light emitting devicein the method of manufacturing the light emitting module according tothe first embodiment. FIG. 4I is a top view showing the process ofdisposing first element structures in the method of manufacturing thelight emitting device according to the first embodiment. FIG. 4J is atop view showing the process of forming a first cover member in themethod of manufacturing the light emitting device according to the firstembodiment. FIG. 4K is a top view showing the process of disposing thelight emitting device in the method of manufacturing the light emittingmodule according to the first embodiment.

Method of Manufacturing Light Emitting Device

A method of manufacturing a light emitting device 100 as one examplewill be explained below.

A method of manufacturing a light emitting device 100 includes: a firstelement structure providing process S101, a frame forming process S102,and a first element structure disposing process S103. The first elementstructure providing process S101 provides a plurality of first elementstructures 15 each including a submount 10, a light emitting element 20,and a light transmissive member 30, in this order. The frame formingprocess S102 forms a frame 50 on a sheet member 70 such that the frame50 surrounds the plurality of first element structures 15. The firstelement structure disposing process S103 disposes the plurality of firstelement structures 15 such that the submounts 10 face the sheet member70. The first cover member forming process S104 forms a first covermember 40 on the sheet member 70 so as to cover the lateral faces of thefirst element structures 15. The sheet member removal process S105removes the sheet member 70.

The first element structure providing process S101 includes: acollective substrate providing process S101 a which provides acollective substrate 11 including a plurality of submount regions 12that will become submounts 10 after the collective substrate 11 isdivided; a light emitting element disposing process S101 b whichindividually disposes light emitting elements 20 on the submount regions12; a light transmissive member disposing process S101 c whichindividually disposes light transmissive members 30 on the lightemitting elements 20; and a first element structure providing processS101 d which provides a plurality of first element structures 15 bydividing the collective substrate 11 into individual submount regions12.

The material used for and the arrangement of each member are asexplained above with reference to the light emitting device 100, andthus the explanation will be omitted here as appropriate.

First Element Structure Providing Process

The first element structure providing process S101 is a process ofproviding a plurality of first element structures 15, each including asubmount 10, a light emitting element 20, and a light transmissivemember 30, in this order.

The process S101 includes a collective substrate providing process S101a, a light emitting element disposing process S101 b, a lighttransmissive member disposing process S101 c, and a first elementstructure providing process S101 d.

Collective Substrate Providing Process

The collective substrate providing process S101 a is a process ofproviding a collective substrate 11 including a plurality of submountregions 12 that will become submounts 10 after the collective substrate11 is divided.

The collective substrate 11 is a single substrate which includes aplurality of submount regions 12 on which light emitting elements 20 arerespectively disposed. In FIG. 4A, a collective substrate 11 includingfour submount regions 12 is shown, but the number of submount regions 12can be suitably adjusted.

Light Emitting Element Disposing Process

The light emitting element disposing process S101 b is a process ofdisposing light emitting elements 20 on a plurality of submount regions12.

In the process S101 b, a plurality of light emitting elements 20 arerespectively disposed on a plurality of submount regions 12. The lightemitting elements 20, using the electrode formed faces as the disposingfaces, are flip-chip mounted on the first wiring parts arranged in thesubmount regions 12 using a conducting bonding material.

At this time, a plurality of protective elements 25 are respectivelydisposed on the submount regions 12.

Light Transmissive Member Disposing Process

The light transmissive member disposing process S101 c is a process ofrespectively disposing light transmissive members 30 on the lightemitting elements 20.

In the process S101 c, for example, each of the light transmissivemembers 30 having a predetermined shape is bonded to the upper face(i.e., the light extraction face) which opposes the electrode formedface of each light emitting element 20. Bonding of the lighttransmissive member 30 to a light emitting element 20 can be performedby a direct bonding or bonding via a light transmissive bondingmaterial.

First Element Structure Providing Process

The first element structure providing process S101 d is a process ofproviding a plurality of first element structures 15 by dividing thecollective substrate 11 into individual submount regions 12.

In the process S101 d, a plurality of first element structures 15 areprovided by dividing the collective substrate 11 at predeterminedpositions to obtain individual first element structures 15.

A light emitting device 100 is manufactured by combining a plurality offirst element structures which have been divided into individual pieces.In other words, because the individual first element structures 15 whichhave been divided can be sorted, first element structures 15 having theemission characteristics in a predetermined range can be selected andcombined as desired to produce a light emitting device 100. This canrealize the production of the light emitting device 100 having a desiredemission color with limited color non-uniformity.

In the manufacturing process, should some of the first elementstructures 15 fail, only the failed first element structures can bediscarded before disposing the first element structures 15 on a sheetmember 70. In the case of a light emitting device in which a pluralityof light emitting elements are disposed on a single submount, the entirelight emitting device must be discarded should some of the parts fail.Accordingly, the method of manufacturing a light emitting deviceaccording to the embodiment can reduce the number of discards in theevent of a failure in the manufacturing process.

Frame Forming Process

The frame forming process S102 is a process of forming a frame 50 on asheet member 70 such that the frame 50 surrounds a plurality of firstelement structures 15.

The frame 50 can be formed by, for example, disposing a frame-shapedmember formed of a material containing a metal, alloy, or ceramic at adesired position on the sheet member 70.

Using a material containing a metal, alloy, or ceramic for the frame 50can inhibit the first cover member 40 from warping, thereby allowing thedisposing face of the light emitting device 100 to be flat. In the caseof using a resin material for the first cover member 40, the contractionof the resin when and after the hardening might cause the light emittingdevice 100 to warp. Employing a non-flexible material for the frame 50can reduce the occurrence of warping. This can improve the mountabilityof the light emitting device 100 onto the module substrate 80.

Forming a frame 50 before the first element structure disposing processS103 allows the first element structures 15 to be disposed on the sheetmember 70 by using the frame 50 as a reference. This can facilitate thefirst element structures 15 to be highly precisely disposed even on asheet member 70 which has no alignment marks for disposing the firstelement structures 15.

First Element Structure Disposing Process

The first element structure disposing process S103 is a process ofdisposing a plurality of first element structures 15 on a sheet member70 such that the submounts 10 face the sheet member 70. In other words,a plurality of first element structures 15 are placed on the sheetmember 70 such that the lower faces of the submounts 10 (i.e., the facesopposing those on which light emitting elements 20 are disposed) are incontact with the upper face of the sheet member 70. In the presentembodiment, the first element structures 15 which have been separatedinto individual pieces are arranged on the sheet member 70. In the casein which a blade is used in separating them into individual pieces, forexample, the first element structures 15 can be arranged atshorter-distanced intervals between adjacent first element structuresthan the blade width. This can produce a light emitting device 100 inwhich the intervals between the emission faces are narrow.

In the process S103, the plurality of first element structures 15 aredisposed on an upper face of a sheet member 70. The first elementstructures 15 are disposed on the upper face of the sheet member 70using the faces on which the second wiring parts 5 are formed asmounting faces.

For the sheet member 70, a heat resistant resin sheet, or those known inthe art can be used.

First Cover Member Forming Process

The first cover member forming process S104 is a process of forming afirst cover member 40 on the sheet member 70 so as to cover the lateralfaces of the first element structures 15.

In the process S104, the first cover member 40 is formed inward of theframe 50 so as to cover the lateral faces of the first elementstructures 15.

In the process S104, an uncured resin material for forming the firstcover member 40 is disposed between the frame 50 and the first elementstructures 15, and between adjacent first element structures 15, bypotting or spraying, for example. Subsequently, the resin material ishardened to form the first cover member 40.

In the process S104, the first cover member 40 is formed covering thelateral faces of the first element structures 15 (i.e., the lateralfaces of the submounts 10, the lateral faces of the light emittingelements 20, and the lateral faces of the light transmissive members 30)while exposing the upper faces of the light transmissive member 30.Alternatively, the first cover member 40 can be formed to cover theupper faces of the light transmissive members 30, and partiallysubsequently removed by polishing, grinding, or cutting to expose theupper faces of the light transmissive member 30.

Sheet Member Removal Process

The sheet member removal process S105 is a process of removing the sheetmember 70.

In the process S105, the sheet member 70 on which the first elementstructures 15 and the like are disposed is removed to complete a lightemitting device 100.

Method of Manufacturing Light Emitting Module

A method of manufacturing a light emitting module 200 as one examplewill be explained next.

A method of manufacturing a light emitting module 200 includes a lightemitting device providing process S11 which provides a light emittingdevice 100 using a method of manufacturing a light emitting device 100,and a light emitting device disposing process S12 which disposes thelight emitting device 100 such that the submounts 10 face a modulesubstrate 80.

The material for and arrangement of each member are as explained abovewith reference to the light emitting module 200, and thus theexplanation will be omitted here as appropriate.

Light Emitting Device Providing Process

The light emitting device providing process S11 is a process ofproviding a light emitting device 100 using the method of manufacturinga light emitting device described above.

In the process S11, a light emitting device 100 is manufactured byperforming the processes S101 to S105 described above.

Light Emitting Device Disposing Process

The light emitting device disposing process S12 is a process ofdisposing a light emitting device 100 on a module substrate 80 such thatthe submounts 10 face the module substrate 80.

In the process S12, a light emitting device 100 is disposed on the upperface of a module substrate 80. The light emitting device 100 is disposedon the upper face of the module substrate 80 using the submounts 10 asmounting faces by using a conductive adhesive 8.

Second Embodiment

FIG. 5A is a top view schematically showing the structure of the lightemitting module including the light emitting device according to asecond embodiment. FIG. 5B is a sectional view taken along line VB-VB inFIG. 5A. FIG. 5C is a sectional view schematically showing the structureof the light emitting device according to the second embodiment.

A light emitting module 200A includes a light emitting device 100A and amodule substrate 80.

Light Emitting Device

A light emitting device 100A will be explained below.

The light emitting device 100A includes a plurality of first elementstructures 15, a light transmissive member 30 and a first cover member40. The first element structures 15 each include a submount 10, a lightemitting element 20, and a light transmissive member 30, in this order.The second cover member 60 holds the first element structures 15 inplace by covering the lateral faces of the submounts 10. The first covermember 40 has a higher reflectance relative to the light from the lightemitting elements 20 than a reflectance of the second cover member 60,and holds the plurality of first element structures 15 in place bycovering the lateral faces of the light emitting elements 20 and thelateral faces of the light transmissive members 30.

In other words, the light emitting device 100A includes submounts 10,light emitting elements 20, protective elements 25, light transmissivemembers 30, a second cover member 60, a first cover member 40, and aframe 50, as main components.

With regard to the constituents of the light emitting device 100A, thedifferences from those of the light emitting device 100 will beexplained below.

The second cover member 60 is a member disposed around the submounts 10of the plurality of first element structures 15. The second cover member60 is formed so as to cover the lateral faces of the submounts 10 byusing, for example, a heat dissipating resin, which is a resincontaining a heat dissipating material. The second cover member 60 isformed inward of the frame 50 between the frame 50 and the submounts 10,and between adjacent submounts 10, up to the height of the upper facesof the submounts 10.

Examples of resin materials for use as the second cover member 60include those described as examples for the light transmissive members30.

Examples of heat dissipating materials include silicone, aluminum oxide,aluminum nitride, boron nitride, and magnesium oxide employed for heatdissipation purposes.

It is preferable to suitably select a material for the second covermember 60 so as to have a better heat dissipation property than a heatdissipation property of the first cover member 40.

The first cover member 40 is formed on the upper face of the secondcover member 60. The first cover member 40 covers the lateral faces ofthe light emitting elements 20 and the lateral faces of the lighttransmissive members 30. The first cover member 40 is formed inward ofthe frame 50 between the frame 50 and the light emitting elements 20,between the frame 50 and the light transmissive members 30, betweenadjacent light emitting elements 20, and between adjacent lighttransmissive members 30.

A material is suitably selected for the first cover member 40 so as tohave a higher reflectance relative to the light from the light emittingelements 20 than a reflectance of the second cover member 60.

Light Emitting Module

A light emitting module 200A will be explained next.

The light emitting module 200A is substantially the same as or similarto the light emitting module 200 according to the first embodimentexcept for employing a light emitting device 100A.

Manufacturing Methods of Second Embodiment

FIG. 6 is a flowchart of a method of manufacturing a light emittingdevice according to a second embodiment. FIG. 7A is a sectional viewshowing the process of forming a second cover member in the method ofmanufacturing the light emitting device according to the secondembodiment. FIG. 7B is a sectional view showing the process of forming afirst cover member in the method of manufacturing the light emittingdevice according to the second embodiment. FIG. 7C is a sectional viewshowing the process of removing the sheet member in the method ofmanufacturing the light emitting device according to the secondembodiment. FIG. 7D is a sectional view showing the process of disposingthe light emitting device in the method of manufacturing the lightemitting module according to the second embodiment. FIG. 7E is a topview showing the process of forming a second cover member in the methodof manufacturing the light emitting device according to the secondembodiment. FIG. 7F is a top view showing the process of forming a firstcover member in the method of manufacturing the light emitting deviceaccording to the second embodiment. FIG. 7G is a top view showing theprocess of disposing the light emitting device in the method ofmanufacturing the light emitting module according to the secondembodiment.

Method of Manufacturing Light Emitting Device

A method of manufacturing a light emitting device 100A as one examplewill be explained below.

The method of manufacturing a light emitting device 100A includes afirst element structure providing process S201, a frame forming processS202, a first element structure disposing process S203, a second covermember forming process S204, and a first cover member forming processS205. The plurality of first element structures 15 each include asubmount 10, a light emitting element 20, and a light transmissivemember 30, in this order. The frame forming process S202 forms a frame50 on a sheet member 70 such that the frame 50 surrounds the pluralityof first element structures 15. The first element structure disposingprocess S203 disposes the first element structures 15 such that thesubmounts 10 face the sheet member 70. The second cover member formingprocess S204 forms a second cover member 60 on the sheet member 70 so asto cover the lateral faces of the submounts 10. The first cover memberforming process S205 forms a first cover member 40 on the second covermember 60 so as to cover the lateral faces of the light emittingelements 20 and the lateral faces of the light transmissive members 30.The first cover member 40 has a higher reflectance relative to the lightfrom the light emitting elements 20 than a reflectance of the secondcover member 60. The sheet member removal process S206 removes the sheetmember 70.

The first element structure providing process S201 includes a collectivesubstrate providing process S201 a, a light emitting element disposingprocess S201 b, a light transmissive member disposing process S201 c,and a first element structure providing process S201 d. The collectivesubstrate providing process S201 divides the collective substrate 11including a plurality of submount regions 12 that will become submounts10 after the collective substrate 11 is divided. The light emittingelement disposing process S201 b respectively disposes light emittingelements 20 on the submount regions 12. The light transmissive memberdisposing process S201 c respectively disposes light transmissivemembers 30 on the light emitting elements 20. The first elementstructure providing process S201 d provides a plurality of first elementstructures 15 by dividing the collective substrate 11 into individualsubmount regions 12.

The material for and arrangement of each member are as explained abovewith reference to the light emitting device 100A, and thus theexplanation will be omitted here as appropriate.

First Element Structure Providing Process

The first element structure providing process S201 is substantially thesame as or similar to the first element structure providing process S101described above.

Frame Forming Process

The frame forming process S202 is substantially the same as or similarto the frame forming process S102 described above.

First Element Structure Disposing Process

The first element structure disposing process S203 is substantially thesame as or similar to the first element structure disposing process S103described above.

Second Cover Member Forming Process

The second cover member forming process S204 is a process of forming asecond cover member 60 on a sheet member 70 so as to cover the lateralfaces of the submounts 10.

In the process S204, a second cover member 60 is formed inward of theframe 50 so as to cover the lateral faces of the submounts 10 with thesecond cover member 60.

In the process S204, an uncured resin material containing a heatdissipating material is disposed between the frame 50 and the submounts10, and between the lateral faces of adjacent submounts 10 facing eachother by, for example, potting or spraying. The second cover member 60is formed by subsequently hardening the resin material.

In the process S204, it is preferable to form the second cover member 60up to the upper faces of the submounts 10 so as to cover the lateralfaces of the submounts 10. The second cover member 60 can cover theupper faces of the submounts 10, but preferably isolated from the lightemitting elements 20.

First Cover Member Forming Process

The first cover member forming process S205 is a process of forming afirst cover member 40 on the second cover member 60 so as to cover thelateral faces of the light emitting elements 20 and the lateral faces ofthe light transmissive members 30. In the process S205, a materialhaving a higher reflectance relative to the light from the lightemitting elements 20 than a reflectance of the second cover member 60 isused for the first cover member 40.

In the process S205, the first cover member 40 is formed inward of theframe 50 so as to cover the lateral faces of the light emitting elements20 and the lateral faces of the light transmissive members 30.

In the process S205, an uncured resin material containing a reflectingmaterial is disposed between the frame 50 and the light emittingelements 20, between the frame 50 and the light transmissive members 30,between adjacent light emitting elements 20, and between adjacent lighttransmissive members 30 by, for example, potting or spraying. The firstcover member 40 is formed by subsequently hardening the resin material.

In the process S205, the first cover member 40 is formed so as to coverthe lateral faces of the light emitting elements 20 and the lateralfaces of the light transmissive members 30 while exposing the upperfaces of the light transmissive members 30. Alternatively, the firstcover member 40 can be formed so as to cover the upper faces of thelight transmissive members 30, and subsequently partially removed bypolishing, grinding, or cutting to expose the upper faces of the lighttransmissive members 30.

Sheet Member Removal Process

The sheet member removal process S206 is substantially the same as orsimilar to the sheet member removal process S105 described above.

Method of Manufacturing Light Emitting Module

A method of manufacturing a light emitting module 200A as one examplewill be explained next.

A method of manufacturing a light emitting module 200A is substantiallythe same as or similar to the method of manufacturing the light emittingmodule 200 according to the first embodiment described above except forusing a light emitting device 100A provided by using the method ofmanufacturing the light emitting device 100A described above.

Third Embodiment

FIG. 8A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to a thirdembodiment. FIG. 8B is a sectional view taken along line in FIG. 8A.FIG. 8C is a sectional view schematically showing the structure of thelight emitting device according to the third embodiment.

The light emitting module 200B has a light emitting device 100B and amodule substrate 80.

Light Emitting Device

A light emitting device 100B will be explained below.

The light emitting device 100B employs first element structures 15Ainstead of the first elements structures 15. A first element structure15A has a configuration in which the width of the submount 10 isnarrower than the width of the light transmissive member 30 in thelongitudinal direction of the light emitting device 100B in a top view.

The other configurations of the light emitting device 100B aresubstantially the same as or similar to those of the light emittingdevice 100 according to the first embodiment.

Light Emitting Module

A light emitting module 200B will be explained next.

The light emitting module 200B is substantially the same as or similarto the light emitting module 200 according to the first embodiment.

Manufacturing Method of Third Embodiment

FIG. 9 is a flowchart of a method of manufacturing a light emittingdevice according to a third embodiment. FIG. 10A is a sectional viewshowing the process of disposing light emitting elements in secondelement structure providing process of the method of manufacturing alight emitting device according to the third embodiment. FIG. 10B is asectional view showing the process of providing the second elementstructures in the second element structure providing process of themethod of manufacturing the light emitting device according to the thirdembodiment. FIG. 10C is a sectional view showing the process of forminga frame in the method of manufacturing the light emitting deviceaccording to the third embodiment. FIG. 10D is a sectional view showingthe process of disposing the second element structures in the method ofmanufacturing the light emitting device according to the thirdembodiment. FIG. 10E is a sectional view showing the process ofdisposing light transmissive members in the method of manufacturing thelight emitting device according to the third embodiment. FIG. 10F is asectional view showing the process of forming a first cover member inthe method of manufacturing the light emitting device according to thethird embodiment. FIG. 10G is a sectional view showing the process ofremoving the sheet member in the method of manufacturing the lightemitting device according to the third embodiment. FIG. 10H is asectional view showing the process of disposing a light emitting devicein the method of manufacturing the light emitting module according tothe third embodiment.

Method of Manufacturing Light Emitting Device

A method of manufacturing a light emitting device 100B as one examplewill be explained below.

The method of manufacturing a light emitting device 100B includes asecond element structure providing process S301, a frame forming processS302, a second element structure disposing process S303, a lighttransmissive member disposing process S304, a first cover member formingprocess S305, and a sheet member removal process S306. The secondelement structure providing process S301 provides a plurality of secondelement structures 16 each including a submount 10 and a light emittingelement 20 in this order. The frame forming process S302 forms a frame50 on a sheet member 70 such that the frame surrounds the plurality ofsecond element structures 16. The second element structure disposingprocess S303 disposes the plurality of second element structures 16 on asheet member 70 such that the submounts 10 face the sheet member. Thelight transmissive member disposing process S304 respectively disposeslight transmissive members 30 on the light emitting elements 20 afterdisposing the plurality of second element structures 16 on the sheetmember 70. The first cover member forming process S305 forms a firstcover member 40 on the sheet member 70 so as to cover the lateral facesof the second element structures 16 and the lateral faces of the lighttransmissive members 30. The sheet member removal process S306 removesthe sheet member 70.

The second element structure providing process S301 includes acollective substrate providing process S301 a, a light emitting elementdisposing process S301 b, and a second element structure providingprocess S301 c. The collective substrate providing process S301 aprovides a collective substrate 11 that includes a plurality of submountregions 12 that will become submounts 10 after the collective substrate11 is divided. The light emitting element disposing process S301 brespectively disposes light emitting elements 20 on the plurality ofsubmount regions 12. The second element structure providing process S301c provides a plurality of second element structures 16 by dividing thecollective substrate 11 into individual submount regions 12.

The material used for and the arrangement of each member are asexplained above with reference to the light emitting device 100B, andthus the explanation will be omitted here as appropriate.

Second Element Structure Providing Process

The second element structure providing process S301 is a process ofproviding a plurality of second element structures 16 each including asubmount 10 and a light emitting element 20 in this order.

Collective Substrate Providing Process

The collective substrate providing process S301 a is substantially thesame as or similar to the collective substrate providing process S101 adescribed above.

Light Emitting Element Disposing Process

The light emitting element disposing process S301 b is substantially thesame as or similar to the light emitting element disposing process S101b described above.

Second Element Structure Providing Process

The second element structure providing process S301 c is a process ofproviding a plurality of second element structures 16 by dividing thecollective substrate 11 into individual submount regions 12.

In the process 301 c, a plurality of second element structures 16 areprovided by dividing the collective substrate 11 at predeterminedpositions to obtain individual structures.

Frame Forming Process

The frame forming process S302 is a process of forming a frame 50 on asheet member 70 such that the frame 50 surrounds a plurality of secondelement structures 16.

The process S302 is substantially the same as or similar to the frameforming process S102 of the manufacturing method according to the firstembodiment except for forming a frame 50 around the area where secondelement structures 16 will be disposed.

Second Element Structure Disposing Process

The second element structure disposing process S303 is a process ofdisposing a plurality of second element structures 16 on a sheet member70 such that the submounts 10 face the sheet member.

The process S303 is substantially the same as or similar to the firstelement structure disposing process S103 or the manufacturing methodaccording to the first embodiment except for disposing the secondelement structures 16 on the upper face of the sheet member 70.

Light Transmissive Member Disposing Process

The light transmissive member disposing process S304 is a process ofrespectively disposing light transmissive members 30 on light emittingelements 20 after disposing a plurality of second element structures 16on a sheet member 70.

In the process S304, for example, a light transmissive member 30 havinga predetermined shape is bonded to the upper face (i.e., the mainlylight extraction face) of each light emitting element 20. Bonding of thelight transmissive member 30 to the light emitting element 20 can beperformed by directly bonding or bonding via a light transmissivebonding material. The first element structure 15A after the lighttransmissive member 30 is bonded to the light emitting element 20.

In the present embodiment, disposing the light transmissive member 30having a larger upper face than the upper face of a light emittingelement 20 on each light emitting element 20 can achieve a smallerdistance between adjacent light transmissive members 30 than thedistance between adjacent second element structures 16 (i.e., betweensubmounts 10). This can produce a light emitting device 100B in whichthe intervals between the emission faces are even narrower.

First Cover Member Forming Process

The first cover member forming process S305 is a process of forming afirst cover member 40 on the sheet member 70 so as to cover the lateralfaces of the second element structures 16 and the lateral faces of thelight transmissive members 30. In other words, the process S305 is aprocess of forming a first cover member 40 on the sheet member 70 so asto cover the lateral faces of the first element structures 15A.

The process S305 is substantially the same as or similar to the firstcover member forming process S104 in the first manufacturing method.

Sheet Member Removal Process

The sheet removal process S306 is substantially the same as or similarto the sheet removal process S105 described above.

In the method of manufacturing a light emitting device 100 according tothe first embodiment, the collective substrate 11 is divided intoindividual submount regions 12 after disposing the light emittingelements 20 and the light transmissive members 30 on the collectivesubstrate 11. Accordingly, the width of the submount 10 is substantiallythe same as or larger than the width of the light transmissive member 30in a top view in each of the second element structures 16. In this case,in order to reduce the distance between adjacent light transmissivemembers 30 on the sheet member 70, the distance between adjacentsubmounts 10 needs to be reduced. In other words, the distance betweenadjacent light transmissive members 30 is restricted by the width of asubmount 10.

In contrast, in the method of manufacturing a light emitting device 100Baccording to the third embodiment, light transmissive members 30 aredisposed after disposing the second element structures 16 on the upperface of the sheet member 70. Accordingly, the width of the submount 10can be made narrower than the width of the light transmissive member 30in a top view in each of the second element structures 16. In this case,regardless of the distance between two submounts 10, the distancebetween adjacent light transmissive members 30 can be reduced byadjusting the width of each light transmissive member 30 on the sheetmember 70. Accordingly, regardless of the width of a submount 10, thedistance between adjacent light transmissive members 30 can be adjusted.Furthermore, the second element structures 16 can more easily bedisposed on the sheet member 70, thereby improving alignment accuracy ofthe second element structures 16.

Method of Manufacturing Light Emitting Module

A method of manufacturing a light emitting module 200B as one examplewill be explained next.

The method of manufacturing a light emitting module 200B issubstantially the same as or similar to the method of manufacturing thelight emitting module 200 according to the first embodiment except foremploying the light emitting device 100B provided by using the method ofmanufacturing the light emitting device 100B described above.

Fourth Embodiment

FIG. 11A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to a fourthembodiment. FIG. 11B is a sectional view taken along line XIB-XIB inFIG. 11A. FIG. 11C is a sectional view schematically showing thestructure of the light emitting device according to the fourthembodiment.

A light emitting module 200C includes a light emitting device 100C and amodule substrate 80.

Light Emitting Device

The light emitting device 100C will be explained below.

The light emitting device 100C employs first element structures 15Ainstead of first element structures 15. The first element structure 15Ais formed such that the width of the submount 10 is narrower than thewidth of the light transmissive member 30 in the longitudinal directionof the light emitting device 100C in a top view.

The other aspects are substantially the same as or similar to those ofthe light emitting device 100A according to the second embodiment.

Light Emitting Module

The light emitting module 200C will be explained next.

The light emitting module 200C is substantially the same as or similarto the light emitting module 200A of the second embodiment except foremploying the light emitting device 100C.

Manufacturing Method of Fourth Embodiment

FIG. 12 is a flowchart of a method of manufacturing a light emittingdevice according to a fourth embodiment.

Method of Manufacturing Light Emitting Device

A method of manufacturing a light emitting device 100C as one examplewill be explained below.

The method of manufacturing a light emitting device 100C includes: asecond element structure providing process S401, a fame forming processS402, a second element structure disposing process S403, a lighttransmissive member disposing process S404, and a second cover memberforming process S405, and a first cover member forming process S406. Thesecond element structure disposing process S40 provides a plurality ofsecond element structures 16 each including a submount 10 and a lightemitting element 20 in this order. The frame forming process S402 formsa frame on a sheet member 70 so as to surround the plurality of secondelement structures 16. The second element structure disposing processS403 disposes the plurality of second element structures 16 on a sheetmember 70 such that the submounts 10 face the sheet member. The lighttransmissive member disposing process S404 respectively disposes lighttransmissive members 30 on the light emitting elements 20 afterdisposing the plurality of second element structures 16 on the sheetmember 70. The second cover member forming process S405 forms a secondcover member 60 on the sheet member 70 so as to cover the lateral facesof the submounts 10. The first cover member forming process S406 forms afirst cover member 40 on the second cover member 60 so as to cover thelateral faces of the light emitting elements 20 and the lateral faces ofthe light transmissive members 30. The first cover member 40 has ahigher reflectance relative to the light from the light emittingelements than the reflectance of the second cover member 60. Thea sheetmember removal process S407 removes the sheet member 70.

The first element structure providing process S401 includes a collectivesubstrate providing process S401 a, a light emitting element disposingprocess S401 b, and a second element structure providing process S401 c.The collective substrate providing process S401 a provides a collectivesubstrate 11 including a plurality of submount regions 12 that willbecome submounts 10 after the collective substrate 11 is divided. Thelight emitting element disposing process S401 b respectively disposesthe light emitting elements 20 on the plurality of submount regions 12.The second element structure providing process S401 c provides aplurality of second element structures 16 by dividing the collectivesubstrate 11 into individual submount regions 12.

The method of manufacturing a light emitting device 100C issubstantially the same as or similar to the method of manufacturing thelight emitting device 100A of the second embodiment except fordisposition of the light transmissive members 30 on the light emittingelements 20 is performed after disposing the second element structures16 on a sheet member 70.

Method of Manufacturing Light Emitting Module

One example of a method of manufacturing a light emitting module 200Cwill be explained next.

The method of manufacturing a light emitting module 200C issubstantially the same as or similar to the method of manufacturing thelight emitting module 200 according to the first embodiment except forusing the light emitting device 100C provided by using the method ofmanufacturing a light emitting device 100C described above.

In the foregoing, methods of manufacturing light emitting devices andmethods of manufacturing light emitting modules, as well as lightemitting devices and light emitting modules have been specificallyexplained with reference to certain embodiments of the presentinvention. However, the subject matter of the present invention is notlimited to these, and must be broadly interpreted based on thedisclosure in the scope of the claims. Moreover, various modificationsand alterations made based on the disclosure are also encompassed by thesubject matter of the present invention.

Other Embodiments

FIG. 13A is a sectional view schematically showing the structure of alight emitting device according to another embodiment. FIG. 13B to FIG.13H are top views schematically showing the structures of light emittingmodules including light emitting devices according to other embodiments.FIG. 14A is a top view schematically showing the structure of a lightemitting module including a light emitting device according to anotherembodiment. FIG. 14B is a sectional view taken along line XIVB-XIVB inFIG. 14A. FIG. 14C is a bottom view schematically showing the structureof the light emitting device according to the embodiment shown in FIG.14A. FIG. 15A is a schematic sectional view of the structure of a lightemitting module according to another embodiment. FIG. 15B is a flowchartof a method of manufacturing the light emitting module according to theembodiment shown in FIG. 15A.

The light emitting module 200D and the light emitting device 100Dinclude a frame 50A which is formed of a resin containing a lightreflecting material.

Examples of resin materials for use in the frame 50A include, forexample, those described for use in the light transmissive member 30.Examples of light reflecting materials for use in the frame 50A include,for example, those described for use as a reflecting material in thefirst cover member 40.

The frame 50A can be formed in a desired position on the sheet member 70by using, for example, a dispenser (such as a resin dispenser) that cancontinuously dispense a liquid resin using air pressure (see JapanesePatent Publication No. 2009-182307).

The frame 50B of the light emitting module 200E and the light emittingdevice 100E has a substantially rectangular shape in a top view andformed using multiple different materials. The rectangular of the frame50B has two long sides which are bar-shaped members 51 formed of a morerigid material than the material of the first cover member 40, and twoshort sides which are resin members 52 formed of a resin containing areflecting material. Specific examples of materials used for thebar-shaped members 51 include materials containing metals, alloys,and/or ceramics.

The rectangular of the frame 50B can be formed by placing bar-shapedmembers 51 in the long side regions and disposing resin members 52 inthe short side regions. Optionally, only one bar-shaped member 51 can bedisposed along one of the rectangular long sides.

The frame 50C of the light emitting module 200F and the light emittingdevice 100F has a substantially rectangular shape in a top view, and thetwo rectangular long sides formed of a material containing a metal,alloy, or ceramic. In the frame 50C, bar-shaped members 51 formed of amaterial more rigid than the material of the first cover member 40 areplaced along the rectangular long sides, and a rectangular-shaped resinmember 52 formed of a resin containing a reflecting material is disposedto cover the bar-shaped members 51.

The light emitting module 200G and the light emitting device 100Ginclude a frame 50D which includes a bar-shaped member 51 only along oneof the long sides. The other aspects are substantially the same as orsimilar to those in the light emitting module 200F and the lightemitting device 100F.

Employing a bar-shaped member 51 for a portion of the frame in a lightemitting device can inhibit warping of the first cover member 40 whenhardened. This can also reduce warping of the second cover member 60when hardened.

The light emitting module 200H and the light emitting device 100Hinclude a plurality of first element structures 15 arranged in rows andcolumns. In the present embodiment, a total of 27 first elementstructures 15 are arranged in three rows, in which seven in the firstrow, nine in the second row, and eleven in the third row.

The light emitting module 200I and the light emitting device 100I have aplurality of first element structures 15 that are arranged in an arrayof two rows by eleven columns. In the present embodiment, each of thefirst element structures 15 at both ends in each row is positioned so asto be more distant from the adjacent first element structure 15 in thedirection of rows than the distance between other adjacent first elementstructures 15 in the direction of rows.

The light emitting module 200J and the light emitting device 100Jinclude a combination of first element structures 15 having emissionfaces with different sizes. In the present embodiment, first elementstructures 15 each having a small emission face are arranged in thecentral portion of the light emitting device 100J while being arrangedin an array of two rows by six columns. Three first element structures15 each having a large emission face are arranged on both outer sides inthe direction of rows of the group of the first element structures 15having a small emission face. In the light emitting module 200J and thelight emitting device 100J, by arranging first element structures 15having small emission faces are arranged in the central portion, thefirst element structure 15 can be more densely arranged in the centralportion than in the case of arranging first element structures 15 havinga large emission face. In the case of being employed as the light sourceof a vehicle headlight, for example, the light emitting module 200J andthe light emitting device 100J in which the first element structures 15are densely arranged in the central portion can illuminate the centralportion (mainly the road surface) in a more highly defined manner.

The light emitting module 200K and the light emitting device 100Kinclude first element structures 15 arranged in a staggered manner intwo rows. In the present embodiment, the first element structures 15 inthe first row and the first element structures 15 in the second row arearranged by shifting the positions in the direction of rows so as tohave zero gap at most in the direction of rows. Because there is zerogap at most between the first element structures in the direction ofrows, the light emitting module 200K and the light emitting device 100Kcan illuminate with a more highly defined manner in a lateral direction,in the case of being employed as, for example, the light source of avehicle headlight.

As described above, in a light emitting module and a light emittingdevice, number of rows and columns are not limited, and the number offirst element structures 15 can be suitably adjusted in accordance witha desired luminous intensity distribution pattern. For a light emittingmodule and a light emitting device, moreover, the combination and thelayout of the first element structures 15 of various emission face sizescan be suitably adjusted in accordance with any luminous intensitypattern.

The light emitting module 200L includes a light emitting device 100L anda module substrate 80.

The light emitting device 100L includes a plurality of third elementstructures 17 and a first cover member 40 holding the third elementstructures 17 in place by covering the lateral faces of the thirdelement structures 17. The third element structures 17 each include asubmount 10, a light emitting element 20, and a light transmissivemember 30, in this order. Each of the plurality of third elementstructures 17 includes a protective element 25.

In other words, the light emitting device 100L includes, submounts 10,light emitting elements 20, protective elements 25, light transmissivemembers 30, and first cover members 40, as the main components.

The third element structures 17 include red element structures 17 aemitting red light, blue element structures 17 b emitting blue light,and green element structures 17 c emitting green light. In the presentembodiment, the third element structures 17 are arranged in two rows bytwo columns in which two red element structures 17 a are arrangeddiagonally, and a blue element structure 17 b and a green elementstructure 17 c are arranged diagonally.

In the third element structures 17, the protective elements 25 arepoisoned outside of the arrangement of the third element structure. Thisallows the four light transmissive members 30 to be arranged in rows andcolumns at smaller intervals.

A red element structure 17 a can have a configuration including, forexample, a blue light emitting element 20 and a light transmissivemember 30 containing a red light emitting phosphor. A blue elementstructure 17 b can have a configuration including, for example, a bluelight emitting element 20 and a light transmissive member 30 containinga diffuser. A green element structure 17 c can have a configurationincluding, for example, a green light emitting element 20 and a lighttransmissive member 30 containing a diffuser. Alternatively, a greenelement structure 17 c can have a configuration including, for example,a blue light emitting element 20 and a light transmissive member 30containing a green-emitting phosphor.

For a light transmissive member 30 containing a red light emittingphosphor or green light emitting phosphor, one made by forming a glasslayer containing a phosphor or resin layer containing a phosphor on thesurface of a glass sheet can be used. For a light transmissive member 30containing a diffuser, one made by forming a glass containing a diffuseror resin layer containing a diffuser on the surface of a glass sheet canbe used.

In the case of combining element structures with different emissioncolors to configure the third element structures 17, the elementstructures having the same height can inhibit the first cover members 40from creeping onto the upper faces of the light transmissive member 30.The thickness differences among the resin layers of the elementstructures resulting from the presence or absence of phosphors, ordifference of the amounts of phosphors required to achieve desiredemission colors, can be evened out by adjusting the thicknesses of theglass sheets supporting the resin layers.

The light emitting module 200L has a configuration in which the lightemitting device 100L described above is disposed on a module substrate80.

The other configurations are substantially the same as or similar tothose in the light emitting device 100 and light emitting module 200according to the first embodiment.

In addition, the light emitting device can have a configurationincluding a single red element structure 17 a, a single blue elementstructure 17 b, and a single green element structure 17 c. The lightemitting device can have a configuration in which the red elementstructures 17 a, the blue element structures 17 b, and the green elementstructures 17 c are alternately arranged in a row or matrix. The lightemitting device can have a configuration including an element structureemitting white light and an element structure emitting amber light. Thelight emitting device can employ element structures that emit variouscolors by suitably selecting light emitting elements 20 having desiredwavelengths as well as adjusting the types and mixing ratios of thephosphors contained in the light transmissive members 30. Such elementstructures can be arranged in any desired combination.

The light emitting module 200M is another example of the method ofmanufacturing a light emitting module manufactured by using a modulesubstrate 80 in place of a sheet member 70. In other words, a lightemitting device is directly formed on a module substrate 80. The lightemitting device in the present example can have a configurationincluding, for example, the light emitting module 200M that includes thefirst element structures 15, the first cover member 40, and the frame50A.

In the light emitting module 200M, the frame 50A formed using a resin isdirectly bonded to the module substrate 80. In the light emitting module200M, the first cover member 40 is formed on the module substrate 80 andinward of the frame 50A, and the lateral faces of the third wiring parts7 and the lateral faces of the conductive adhesive 8 are also covered bythe first cover member 40. The other configurations are substantiallythe same as or similar to those in the light emitting module 200according to the first embodiment.

A method of manufacturing a light emitting module 200M includes: a firstelement structure providing process S501, a first element structuredisposing process S502, a frame forming process S503, and a first covermember forming process S504. The first element structure providingprocess S501 provides a plurality of first element structures 15 eachincluding a submount 10, a light emitting element 20, and a lighttransmissive member 30, in this order. The first element structuredisposing process S502 disposes the plurality of first elementstructures 15 on a module substrate 80 such that the submounts 10 facethe module substrate. The frame forming process S503 forms a frame 50Aon the module substrate 80 so as to surround the plurality of firstelement structures 15. The first cover member forming process S504 formsa first cover member 40 inward of the frame 50A so as to cover thelateral faces of the first element structures 15.

The first element structure providing process S501 includes a collectivesubstrate providing process S501 a, a light emitting element disposingprocess S501 b, a light transmissive member disposing process S501 c,and a first element structure providing process S501 d. The firstelement structure providing process S501 is substantially the same as orsimilar to the first element structure providing process S101 discussedearlier.

In the first element structure disposing process S502, a plurality offirst element structures 15 are disposed on the upper face of a modulesubstrate 80. The first element structures 15 are disposed on the upperface of the module substrate 80 via a conductive adhesive 8 using theface having the second wiring parts 5 formed thereon as the mountingface.

In the frame forming process S503, a frame 50A is formed on the modulesubstrate 80.

In the first cover member forming process S504, a first cover member 40is formed inward of the frame 50A so as to cover the lateral faces ofthe third wiring parts 7, the lateral faces of the conductive adhesive8, and the lateral faces of the first element structures 15.

The other configurations can be processed by following the methods ofmanufacturing the light emitting modules 200 and 200D.

In the method of manufacturing a light emitting module 200M, the firstelement structures 15 can be disposed on the module substrate 80 afterforming a frame 50A on the module substrate 80.

The frame can be formed of a material containing a metal, alloy, or aceramic.

The light emitting devices and the light emitting modules explainedabove can include a frame or no frame. In the case of including a frame,the frame can be disposed intermittently along the perimeter of a lightemitting device. The height of the frame can be lower than the height ofthe first element structures. The submounts and the module substrate canhave substantially square shape in a top view. The frame can also havesubstantially square shape in a top view. The submounts, the modulesubstrate, and the frame can have other shapes.

The methods of manufacturing light emitting devices and the methods ofmanufacturing light emitting modules can include another process during,before, or after any of the processes described above, to the extentthat such a process does not adversely affect the processes describedabove. For example, a foreign matter removal process can be included toremove foreign matter trapped during manufacturing.

The first element structure providing process has been explained aboveas disposing light transmissive members 30 on light emitting elements 20after disposing the light emitting elements 20 on submounts 10. However,the light transmissive members 30 can be disposed on the light emittingelements 20 before being disposed on the submounts 10. The lightemitting elements 20 and the light transmissive members 30 can bedisposed on the submounts 10 after dividing a collective substrate 11.The light emitting elements 20 can be disposed on the submounts 10 afterdividing a collective substrate 11 also in the second element structureproviding process.

The light emitting device 100 according to the first embodiment and thelight emitting device 100A according to the second embodiment can bemanufactured by disposing the light transmissive members 30 on the lightemitting elements 20 after disposing the second element structures 16 ona sheet member 70.

In the methods of manufacturing light emitting devices and methods ofmanufacturing light emitting modules, the order of performing certainprocesses is not limited, and can be switched around. For example, inthe methods of manufacturing light emitting devices described above, theframe forming process is performed before the first element structuredisposing process, or before the second element structure disposingprocess. However, the frame forming process can be performed after thefirst element structure disposing process, before the first cover memberforming process, or before the second cover member forming process. Theframe forming process can be performed after the second elementstructure disposing process, before the first cover member formingprocess, or before the second cover member forming process. The frameforming process can be performed before the first element structureproviding process, or before the second element structure providingprocess.

In the case of forming a second cover member, the sheet member removalprocess can be performed after the second cover member forming processor before the first cover member forming process.

The light emitting devices and the light emitting modules according tothe embodiments of the present disclosure can be utilized as lightsources for adaptive driving beam headlights. In addition, the lightemitting devices and the light emitting modules according to theembodiments of the present disclosure can be utilized as light sourcesfor backlights in liquid crystal displays, and in various lightingfixtures, large sized displays, various display devices such asbillboards and destination signs, image pickup devices for digital videocameras, facsimiles, copiers, and scanners, projectors, and the like.

What is claimed is:
 1. A light emitting device comprising: a pluralityof element structures each including a submount, a light emittingelement, and a light transmissive member, in this order; and a firstcover member holding the element structures by covering lateral faces ofeach of the element structures, wherein the first cover member coverslateral faces of the submounts, lateral faces of the light emittingelements, and an entirety of the lateral faces of the light transmissivemembers.
 2. The light emitting device according to claim 1, furthercomprising a frame surrounding the element structures, wherein the firstcover member is disposed inward of the frame.
 3. The light emittingdevice according to claim 2, wherein the frame has a rectangular shapein a top view.
 4. The light emitting device according to claim 3,wherein at least one long side of long sides of the rectangular shape isa material containing a metal, an alloy, or a ceramic.
 5. The lightemitting device according to claim 2, wherein the frame is a materialcontaining a metal, an alloy, or a ceramic.
 6. The light emitting deviceaccording to claim 1, wherein the first cover member is a lightreflecting resin.
 7. The light emitting device according to claim 1,wherein the first cover member directly covers lateral faces of thesubmounts and directly covers lateral faces of the light emittingelements.
 8. The light emitting device according to claim 1, wherein thefirst cover member directly covers an entirety of the lateral faces ofthe light emitting elements.
 9. A light emitting module comprising: thelight emitting device according to claim 1; and a module substrate onwhich the light emitting device is disposed such that a plurality ofsubmounts face the module substrate.
 10. A light emitting devicecomprising: a plurality of element structures each including a submount,a light emitting element, and a light transmissive member, in thisorder; a first cover member holding the element structures by coveringlateral faces of each of the light emitting elements and lateral facesof each of the light transmissive members; and a second cover memberholding the element structures by covering lateral faces of each of thesubmounts, wherein the first cover member has a higher light reflectancerelative to light from the light emitting elements than a lightreflectance of the second cover member, and wherein the second covermember does not directly contact the light emitting elements.
 11. Thelight emitting device according to claim 10, wherein a heat dissipationof the second cover member is higher than a heat dissipation of thefirst cover member.
 12. The light emitting device according to claim 10,further comprising a frame surrounding the element structures, whereinthe second cover member and the first cover member are disposed inwardof the frame.
 13. The light emitting device according to claim 12,wherein the frame has a rectangular shape in a top view.
 14. The lightemitting device according to claim 13, wherein at least one long side oflong sides of the rectangular shape is a material containing a metal, analloy, or a ceramic.
 15. The light emitting device according to claim12, wherein the frame is a material containing a metal, an alloy, or aceramic.
 16. The light emitting device according to claim 10, whereinthe first cover member is a light reflecting resin.
 17. The lightemitting device according to claim 10, wherein the first cover memberdirectly covers lateral faces of the light emitting elements anddirectly covers lateral faces of the light transmissive members.
 18. Thelight emitting device according to claim 17, wherein the second covermember directly covers lateral faces of the submounts.
 19. The lightemitting device according to claim 10, wherein the first cover memberdirectly covers an entirety of the lateral faces of the light emittingelements.
 20. A light emitting module comprising: the light emittingdevice according to claim 10; and a module substrate on which the lightemitting device is disposed such that a plurality of submounts face themodule substrate.